Battery and lead-insulating film

ABSTRACT

A lithium battery (1) has a battery module (2), a battery package (5) for holding the battery module (2) therein, and leads (4) extending from the battery module (2) and projecting outside from the battery package (5). The battery package (5) is formed from a laminated sheet (10), and a peripheral part (9) of the battery package (5) is heat-sealed. Lead-insulating films (6) are interposed between the peripheral part (9) of the package (5) and the leads (4). Each of the lead-insulating films includes a heat-resistant base film (22), a polyolefin resin layer (21) formed on one of the surfaces of the base film (22) on the side of the laminated sheet (10), and an acid-modified polyolefin resin layer (23) formed on the other surface of the base film (22) on the side of the lead (4).

CROSS-REFERENCE TO RELATED APPLICATIONS

This is a Division of application Ser. No. 10/204,553 filed Aug. 22,2002, which in turn is a National Stage of PCT/JP02/00346 filed Jan. 18,2002. The entire disclosure of the prior application is herebyincorporated by reference in its entirety.

BACKGROUND

The present invention relates to a battery, such as a lithium battery,and a lead-insulating film for the battery.

A lithium battery, which also called a lithium secondary battery, uses asolid polymer electrolyte, a gel polymer electrolyte or a liquidelectrolyte, and generates a current by the migration of lithium ions.Active substances forming the positive and the negative electrodecontain a polymer. A lithium-ion battery as a representative batterywill be described.

A lithium secondary battery includes a positive electrode (aluminum ornickel), a positive electrode active layer (a metal oxide, carbon black,a metal sulfide, an electrolyte or a positive electrode polymer, such aspolyacrylonitrile, electrolyte), electrolyte layers (a carbonateelectrolyte, such as propylene carbonate, ethylene carbonate, dimethycarbonate or ethylene-methyl carbonate, an inorganic solid electrolyte,such as a lithium salt, or a gel electrolyte), a negative electrodeactive substance (lithium, an alloy, carbon, an electrolyte, a negativeelectrode polymer, such as polyacrylonitrile), a negative electrode(copper, nickel, a stainless steel), and a package containing thosecomponents.

Lithium batteries are used on personal computers, portable remoteterminals, such as portable telephones, PDAs and the liken, videocameras, electric vehicles, energy storage batteries, robots, artificialsatellites and the like.

The package of the lithium battery is a cylindrical or parallelepipedicmetal can formed by press-working a metal blank or a pouch formed byprocessing a laminate structure, such as a composite film formed bylaminating a film and a metal foil.

Such packages for lithium batteries have the following problems. Themetal can is relatively hard and hence the shape of the battery isdependent on that of the metal can. Consequently, an external structurethat uses the battery needs to be designed so as to conform to the shapeof the battery, the dimensions of the external structure are dependenton the battery, and free choices in designing the external structure arereduced.

Therefore, there is a tendency to use pouches as packages. The packageis formed from a laminated sheet having, in view of physical propertiesrequired of the lithium battery, workability and economicalrequirements, at least a base layer, a barrier layer, heat-sealablelayer, and bonding resin layers for bonding together the adjacentlayers. When necessary, the laminated sheet further has an intermediatelayer.

Such a package for a lithium battery is a pouch formed from such alaminated sheet or an embossed package having a battery holding partformed by press-working a laminated sheet. A lithium battery module isput in the package, and peripheral parts of the package are heat-sealedhermetically to complete a lithium battery.

A part of the heat-sealable layer must be capable of being bonded toanother part of the same by heat-sealing and of being bonded to metalleads extending from the battery module. Therefore, an acid-modifiedpolyolefin resin adhesive to metal members is used for forming theheat-sealable layer.

The workability of an acid-modified polyolefin resin, as compared withthat of general polyolefin resins, is low and an acid-modifiedpolyolefin resin is expensive for forming the heat-sealable layer of thepackage. Therefore, a method uses a general polyolefin resin layer as aheat-sealable layer for a package, and places a lead-insulating filmcapable of being bonded to both the heat-sealable layer and a leadbetween the heat-sealable layer and the lead.

Possible lead-insulating films are those of unsaturated carboxylic acidgraft polyolefin resins, metal-crosslinked polyethylene resins, andcopolymers of ethylene or propylene, and acrylic acid or methacrylicacid.

When the heat-sealable layer of the laminated sheet forming a packagefor a lithium battery is formed of a polyethylene resin, the followingproblems arises when a lithium battery module is put in the package,lead-insulating films are interposed between leads and the package, anda peripheral part of the package is sealed hermetically. If thelead-insulating film is, for example, a single-layer film of anacid-modified polyethylene resin, parts of the heat-sealable layer andparts of the lead-insulating films corresponding to the leads melt whenheat and pressure are applied thereto for heat-sealing and, sometimes,parts of the heat-sealable layer and the lead-insulating films areextruded outside pressed regions. Consequently, an aluminum foil servingas the barrier layer of the package comes into contact with the metalleads to short-circuit the lithium battery module.

Similarly, when the heat-sealable layer of the laminated sheet formingthe package is formed of a polypropylene resin, it occurs sometimes thatan aluminum foil serving as the barrier layer of the package comes intocontact with the metal leads to short-circuit the lithium battery moduleeven if single-layer lead-insulating films of an acid-modifiedpolypropylene resin are employed.

SUMMARY

The present invention has been made in view of the foregoing problemsand it is therefore an object of the present invention to providebattery including a battery module, and a package containing the batterymodule, capable of stably sealing the battery module therein withoutshort-circuiting leads included in the battery module by a barrier layerincluded therein when the battery module is put in the package, and heatand pressure are applied to a peripheral part of the package toheat-seal the package.

According to the present invention, a battery includes: a batterymodule; a battery package for holding the battery module therein; andleads extending from the battery module and projecting outside from thebattery package; wherein the battery package is formed from a laminatedsheet, a peripheral part of the package is heat-sealed, andlead-insulating films are interposed between the peripheral part of thepackage and the leads.

In the battery according to the present invention, each of thelead-insulating films includes a heat-resistant base film, and a pair ofresin layers formed on the opposite surfaces of the heat-resistant basefilm, respectively, by an extrusion lamination process.

In the battery according to the present invention, one resin layer onthe side of the laminated sheet of the pair of resin layers is formed ofa polyolefin resin, and the other resin layer on the side of the lead isformed of an acid-modified polyolefin resin.

In the battery according to the present invention, the heat-resistantbase film is formed of one of polyethylene terephthalate resins,polyethylene naphthalate resins, polyphenylene sulfide resins,polymethyl pentene resins, polyacetal resins, cyclic polyolefin resinsand polypropylene resins.

In the battery according to the present invention, the leads have theshape of an elongate plate or a bar, and are formed of a metal.

In the battery according to the present invention, the laminated sheetincludes at least a base layer, an aluminum layer and a heat-sealablelayer, and the heat-sealable layer is formed of a polyolefin resin.

In the battery according to the present invention, the lead-insulatingfilm is a coextruded film formed by coextrusion and consists of apolyolefin resin layer on the side of the laminated sheet, anacid-modified polyolefin resin layer on the side of the lead, and anadhesive polymethyl pentene resin layer interposed between thepolyolefin resin layer and the acid-modified polyolefin resin layer.

In the battery according to the present invention, the polyolefin resinlayer of the coextruded film is formed of a polyethylene resin

In the battery according to the present invention, the polyolefin resinlayer of the coextruded film is formed of a polypropylene resin.

In the battery according to the present invention, the laminated sheetincludes, at least a base layer, an aluminum layer and a heat-sealablelayer, and the heat-sealable layer is formed of a polyolefin resin.

According to the present invention, a lead-insulating film for bonding alead extending through and projecting outside from a heat-sealedperipheral part of a battery package formed from a laminated sheet tothe battery package includes: a heat-resistant base film, and a pair ofresin layers formed on the opposite surfaces of the heat-resistant basefilm, respectively, by extrusion lamination process.

In the lead-insulating film according to the present invention, oneresin layer on the side of the laminated sheet of the pair of resinlayers is formed of a polyolefin resin, and the other resin layer on theside of the lead is formed of an acid-modified polyolefin resin.

In the lead-insulating film according to the present invention, theheat-resistant base film is formed of one of polyethylene terephthalateresins, polyethylene naphthalate resins, polyphenylene sulfide resins,polymethyl pentene resins, polyacetal resins, cyclic polyolefin resinsand polypropylene resins.

In the lead-insulating film according to the present invention, theleads have the shape of an elongate plate or a bar, and are formed of ametal.

According to the present invention, a lead-insulating film for bonding alead extending through and projecting outside from a heat-sealedperipheral part of a battery package formed from a laminated sheet tothe battery package is a coextruded film consisting of a polyolefinresin layer on the side of the laminated sheet, an acid-modifiedpolyolefin resin film on the side of the lead, and an adhesivepolymethyl pentene resin layer interposed between the polyolefin resinlayer and the acid-modified polyolefin resin layer.

In the lead-insulating film according to the present invention, thepolyolefin resin layer of the coextruded film is formed of apolyethylene resin.

In the lead-insulating film according to the present invention, thepolyolefin resin layer of the coextruded film is formed of apolypropylene resin.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows views of assistance in explaining a lead-insulating film ina first embodiment according to the present invention;

FIG. 2 shows views of assistance in explaining a method of attachinglead-insulating films to leads;

FIG. 3 shows views of leads held between lead-insulating films and apackage;

FIG. 4 is a view of assistance in explaining a pouch;

FIG. 5 shows views of assistance in explaining an embossed package;

FIG. 6 shows views of assistance in explaining a method of forming anembossed package;

FIG. 7 shows sectional views of laminated sheets for forming packages;

FIG. 8 shows sectional views of laminated sheets for forming packages;

FIG. 9 shows views of assistance in explaining conventionallead-insulating films, and a lead held between the lead-insulatingfilms; and

FIG. 10 shows views of assistance in explaining a lead-insulating filmin a second embodiment according to the present invention.

DETAILED DESCRIPTION First Embodiment

The present invention makes a package from a moisture-proof,chemical-resistant lithium battery packaging material having aheat-sealable layer of a polyolefin resin, and capable of beingmanufactured at high productivity, and packages a lithium battery modulein the package. The present invention provides a lead-insulating filmcapable of surely sealing the joint between the package and a leadextending from the battery module and projecting outside from thepackage and of preventing contact between the lead and a barrier layerincluded in the package. The lead-insulating film is a multilayer filmconsisting of a heat-resistant base film, and polyolefin resin layersformed on the opposite surfaces of the base film, respectively, by anextrusion process.

Polyolefin resins include propylene resins (homopolymers,ethylene-propylene copolymers, ethylene-propylene-butene copolymers),ethylene resins (low-density polyethylene resins, medium-densitypolyethylene resins, high-density polyethylene resins, linearlow-density polyethylene resins, copolymers of ethylene and butene,copolymers of ethylene, and acrylic acid or methacrylic acid derivative,copolymers of ethylene and vinyl acetate, and polyethylene resinscontaining metal ions), polyethylene resins, graft copolymers each ofunsaturated carboxylic acid and a polyethylene or polypropylene monomer,and blends of some of those.

The present invention will be described with reference to theaccompanying drawings.

FIG. 1(a) is a view of assistance in explaining a lead-insulating filmaccording to the present invention, FIG. 1(b) is a view of assistance inexplaining the positional relation between a lead of a lithium battery,a package and a lead-insulating film, FIG. 1(c) is a sectional view ofassistance in explaining a superposed arrangement of a lead, alead-insulating film and a package in a state before heat-sealing, andFIG. 1(d) is a typical sectional view of a lead and the associated partsin a state after heat-sealing. FIG. 2 shows views of assistance inexplaining a method of interposing a lead-insulating film between a leadand a package;

FIG. 4 is a perspective view of assistance in explaining a pouch for alithium battery.

FIG. 5 shows views of assistance in explaining an embossed package for alithium battery. FIG. 6(a) is a perspective view of assistance inexplaining a method of forming an embossed package, FIG. 6(b) is a viewof an embossed package, FIG. 6(c) is a sectional view taken on lineX₂-X₂ in FIG. 6(b), and FIG. 6(d) is an enlarged view of a part Y, inFIG. 6(c).

FIG. 7 is a sectional view of a laminated sheet from which a package fora lithium battery is made. FIG. 8 is a sectional view of anotherlaminated sheet from which a package for a lithium battery is made.

A battery 1, such as a lithium battery, will be described with referenceto FIG. 4. The battery (lithium battery) 1 has a battery module 2consisting of cells (storage cells) 3, leads 4 connected to the batterymodule 2, and a battery case (package) 5 for holding the battery module2 and the leads 4 therein. A peripheral part (heat-sealed part) 9 of thepackage 5 is heat-sealed, and the leads 4 project outside from thepackage 5.

Lead-insulating films 6 are placed between the opposite surfaces of theleads 4, and opposite walls of the peripheral part 9 of the package 5.

Members will be described hereinafter.

the lead (tab) 4 of the lithium battery 1 is an elongate metal plate orbar. The lead 4 having the shape of a plate has a thickness in the rangeof 50 to 2000 μm and a width in the range of about 2.5 to about 20 mm.The lead 4 is an Al member, a Cu member, Ni-plated Al member or aNi-plated Cu member. As shown in FIG. 1(a), a heat-sealable layer 14included in the package 5 of the lithium battery 1 is formed of a resinthat enables two heat-sealable layers 14 to be bonded together byheat-sealing. Although it is desirable to form the heat-sealable layerof a resin directly bondable to the lead 4 by heat-sealing, as mentionedabove, a single-layer or a multilayer film of a general polyolefinresin, such as a polyethylene resin or a polypropylene resin, or ablended resin is used as the heat-sealable layer 14 of the package 5,and the lead 4 and the heat-sealable layer 14 is hermetically bondedtogether by the lead-insulating film 6 by heat-sealing (FIGS. 1(a) to1(d)).

The package 5 of the lithium battery 1 must be capable of maintainingthe ability of the battery module 2 for a long period of use. As shownin FIGS. 1(a) to 1(d), the package 5 is formed from a laminated sheet 10having a base layer 11, a barrier layer 12, a bonding resin layer 13 anda heat-sealable layer 14.

When a heat-sealable layer 14′ of a laminated sheet 10 forming a package5 of a lithium battery 1 was formed of a polyolefin resin or the like,sometimes, a problem arose in a part of the package 5 corresponding to alead 4′ when putting a battery module 2 in the package and sealing thebattery module 2 in the package 5 by sealing a peripheral part 9 asshown in FIGS. 9(a) and 9(b). For example, when a lead-insulating film6′ of an acid-modified polyolefin resin is used, sometimes, both theheat-sealable layer 14′ and the lead-insulating film 6′ melt when heatand pressure is applied thereto for heat-sealing. Sometimes, both abarrier layer 12′ serving as an insulating layer on the inner side of abarrier layer 12′ of the package 5, and the lead-insulating film 6′ wereextruded outside a pressed region by pressure. Consequently, an aluminumfoil serving as the barrier layer 12′ and the lead 4′ formed of a metalwere connected accidentally to form ajoint S. The inventors of thepresent invention found that such a problem can be solved by using alead-insulating film formed of proper materials and having properstructure through assiduous studies to prevent such a short circuit, andhave made the present invention.

As shown in FIGS. 1(a) and 1(b), the lead-insulating film 6 of thefollowing construction is interposed between the metal lead 4 and theheat-sealable layer 14 of the package 5. The lead-insulating film 6 iscapable of being bonded to both the lead 4 and the heat-sealable layer14 by heat-sealing. To enable the lead-insulating film 6 to maintain aninsulating effect under heat and pressure applied thereto forheat-sealing, the lead-bonding film 6 consists of a heat-resistant basefilm 22, a polyolefin resin layer 21 formed on one of the surfaces ofthe heat-resistant base film 22 with an anchor coat 24 interposedbetween the heat-resistant base film 22 and the polyolefin resin layer21, and an acid-modified polyolefin resin layer 23 formed on the othersurface of the heat-resistant base film 22 with another anchor coat 24interposed between the heat-resistant base film 22 and the acid-modifiedpolyolefin resin layer 23. The polyolefin resin layer 21 and theacid-modified polyolefin resin layer 23 are formed on the base film 22by an extrusion lamination process. The polyolefin resin layer 21 is onthe side of the heat-sealable layer 14, while the acid-modifiedpolyolefin resin layer 23 is on the side of the lead 4. Thelead-insulating film 6 of this construction is capable of avoidingaccidental contact between the barrier layer 12 of the package 5 and thelead 4.

The acid-modified polyolefin resin layer 23 of the lead-insulating film6 is formed of a resin that can be bonded to the lead 4 by heating.Possible resins for forming the acid-modified polyolefin resin layer 23are unsaturated carboxylic acid graft polyolefin resins,metal-crosslinked polyethylene resins, and acid-modified polyethyleneresins including copolymers of ethylene or propylene, and acrylic acidor methacrylic acid, and acid-modified polypropylene resins. Whennecessary, the acid-modified polyolefin resin layer 23 may contain 5% ormore butene, an ethylene terpolymer, butene and propylene, a lowcrystalline ethylene-butene copolymer having a density of 900 kg/m³, anamorphous ethylene-propylene copolymer or a propylene-α-olefincopolymer.

The heat-resistant base film 22 of the lead-insulating film 6 isresistant to heat and is not melted and fluidized under heat-sealingconditions for heat-sealing the peripheral part 9. General heat-sealingconditions include a heating temperature in the range of 180 to 250° C.,a heating time in the range of 1 to 10 s, and a sealing pressure in therange of 0.5 to 10 MPa.

More concretely, the heat-resistant base film 22 is an unoriented ororiented film of a polyethylene terephthalate resin (hereinafterreferred to as “PET”), a polyethylene naphthalate resin (hereinafterreferred to as “PEN”), a polyphenylene sulfide resin (hereinafterreferred to as “PPS”), a polymethyl pentene resin (hereinafter referredto as “TPX”), a polyacetal resin (hereinafter referred to as “POM”), acyclic polyolefin resin or a polypropylene resin. Since the respectivemelting points of those resins are higher than the melting point in therange of 80 to 160° C. of the polyolefin resin layer and the meltingpoint in the range of 75 to 160° C. of the acid-modified polyolefinresin layer, the base film 22 is able to remain in a film when sealingthe battery module 2 in the package 5, and is able to remain in a filmbetween the barrier layer 12 of the package 5, and the lead 4 tofunction as an insulating layer. Thus, the base film 22 is capable ofavoiding formation of the joint S (FIGS. 9(a) and 9(b)) due to contactbetween the barrier layer 12 and the lead 4 during heat-sealing.

The thickness of the lead-insulating film 6 must be ⅓ or above of thethickness of the lead 4. If the thickness of the lead 4 is 100 μm, thethickness of the lead-insulating film 6 may be 30 μm or above.

The polyolefin resin layer 21 of the lead-insulating film 6 must becapable of being bonded to the heat-sealable layer 14 by heat-sealingand must have a thickness of 5 μm or above. The heat-resistant base film22 must be insulating and must have a thickness of 3 μm or above. Theacid-modified polyolefin resin layer 23 must be capable of being bondedto the lead 4 by heat-sealing and must have a thickness of 10 μm orabove.

Generally, the melt-adhesion to a polyolefin resin and an acid-modifiedpolyolefin resin of the heat-resistant base film 2, i.e., the centrallayer of the lead-insulating film 6, is not satisfactory. The polyolefinresin layer 21 and the acid-modified polyolefin resin layer 23 areformed on the opposite surfaces of the base film 22, respectively, bymelt extrusion after producing polar groups, such as —OH groups, —COOHgroups or —C═0 groups, in the surfaces of the heat-resistant base film22 by processing the surfaces of the heat-resistant base film 22 by aflame treatment, a corona discharge treatment or a plasma treatment, orafter increasing the surface areas of the surfaces of the heat-resistantbase film 22 by a surface roughening treatment, such as a blastingtreatment, and forming the anchor coats 24 by primer coating using animine compound, a polyethylene imine compound, an organic titaniumcompound, an isocyanate compound or a silane compound on the treatedsurfaces of the heat-resistant base film 22, respectively. It iseffective to blow ozone against the surfaces of the heat-resistant basefilm 22 when forming the polyolefin resin layer 21 and the acid-modifiedpolyolefin resin layer 23 by melt extrusion.

The package 5 of the lithium battery 1 is a pouch as shown in FIG. 4 oran embossed package as shown in FIGS. 5(a) to 5(c). The pouch may be apillow-type pouch, a three-sided seal pouch or a four-sided seal pouch.FIG. 4 shows a pillow-type pouch 5.

As shown in FIG. 5(a), an embossed package 5 has a case body 5 a (FIG.5(e)) having a hollow part 7 and side walls 8, a cover 5 t and a flange9. As shown in FIG. 5(b), a package 5 may be formed by putting two casebodies 5 a together, and bonding together the four sides of the flanges9 of the case bodies 5 a by heat-sealing. A package 5 may be formed byfolding an embossed sheet having two case bodies 5 a and a middleconnecting part 5 b connecting the case bodies 5 a along the middleconnecting part 5 b so that the case bodies 5 a are put together, andbonding the three sides of the flanges 9 by heat-sealing. Batterymodules 2 are sealed in the packages 5 shown in FIGS. 5(a) to 5(c), andleads 4 project outside from the packages 5, respectively (FIGS. 5(d)and 5(e)).

As mentioned above, the lead-insulating films 6 are interposed betweenthe package and the leads 4 if the heat-sealable layers 14 of thepackage 5 are formed of a material that cannot be bonded to a metal byheat-sealing. As shown in FIGS. 2(a) and 2(b), the lead-insulating films6 are put on the opposite surfaces of the leads 4 connected to thebattery module 2, respectively, or are bonded temporarily to the leads4, the battery module 2 is put in the package 5, and the flanges 9 ofthe package 5 holding the leads 4 between them are heat-sealed.

The lead-insulating films 6 may be wound around predetermined parts ofthe leads 4, respectively, as shown in FIGS. 2(d) and 2(e) instead ofputting the same on the opposite surfaces of the leads 4.

Molten parts mk of the acid-modified polyolefin resin films 21 may bewelded to the leads 4 and the opposite lead-insulating films 6 as shownin FIG. 3(a) or parts wk of the lead-insulating films 6 may be bondedtemporarily to the leads 4 as shown in FIG. 3(b). A molten part mk ofthe lead-insulating film 6 may be bonded beforehand to the heat-sealablelayer 14 of the package 5 as shown in FIG. 3(c) or a part wk of thelead-insulating film 6 may be bonded to the heat-sealable layer 14 ofthe package 5 as shown in FIG. 3(d).

When the leads 4 are formed of aluminum, it is desirable to finish thesurfaces of the leads 4 by a chemical conversion treatment to preventthe dissolution and corrosion of the surfaces of the aluminum leads 4 byhydrogen fluoride produced by the interaction of the electrolyte of thelithium battery and moisture. Concretely, the chemical conversiontreatment is a process of forming an acid-resistant film by using anacid-resistant film forming material, such as a phosphate, a chromate, afluoride or a triazine thiol compound. A phosphoric acid chromatetreatment using a mixture of a phenolic resin, a chromium fluoride (3)compound and phosphoric acid has satisfactory effect. It is morepreferable to use a material prepared by adding a metal, such asmolybdenum, titanium or zirconium, or a metal salt to a resin containingat least a phenolic resin

When the lead-insulating films 6 are placed between the package 5 andthe leads 4 and the package 5 is sealed, the heat-resistant base films22 of the lead-insulating films 6 remain between the barrier layers 12of the package 5 and the leads 4 in the heat-sealed peripheral part 9 asshown in FIG. 1(d), and serve as insulating layers for preventingaccidental contact between the barrier layers 12 and the leads 4.

When the battery module 2 is put in the package 5, and the package 5 issealed with the lead-insulating films 6 interposed between the package 5and the leads 4, the heat-resistant base films 22 remains between theleads 4 and parts of the barrier layers 12 of the package 5corresponding to the leads 4 as shown in FIG. 1(d). Thus, accidentalcontact can be avoided because the heat-resistant films 22 withstandheat and pressure applied thereto during heat-sealing and insulate theleads 4 from the barrier layers 12 of the package 5.

The package 5 for containing the battery module 2 will be describedhereinafter.

The package 5 is formed from a laminated sheet 10 as shown in FIG. 7(a).The laminated sheet 10 may have at least a base layer 11, a bondinglayer 16, a first chemically converted layer 15 a, a barrier layer 12,i.e., an aluminum foil, a second chemically converted layer 15 b, abonding resin layer 13 and a heat-sealable layer 14. The package 5 maybe formed from a laminated sheet 10 having at least a base layer 11, abonding layer 16, a barrier layer 12, a chemically converted layer 15, abonding resin layer 13 and a heat-sealable layer 14 as shown in FIG.7(c). The heat-sealable layers 14 may be coated with liquid paraffinlayers 19, respectively, as shown in FIGS. 7(b) and 7(d).

FIGS. 8(a) to 8(h) show further laminated sheets 10 for forming thepackage 5. As shown in FIGS. 8(a) to 8(f), a bonding resin layer 13 maybe replaced with a bonding layer 16, and a bonding layer 16 may bereplaced with a bonding resin layer 13. As shown in FIGS. 8(e), 8(f) and8(h), heat-sealable layers 14 may be coated with liquid paraffin layers19, respectively. As shown in FIGS. 8(g) and 8(h), base layers 11 may becoated with slip coating layers 17, respectively.

The heat-sealable layer 14 is laminated to the second chemicallyconverted layer 15 b by a dry lamination process, a sandwich laminationprocess, a coextrusion lamination process or a thermal laminationprocess. Parts of laminated sheets 10 shown in FIGS. 8(a) to 8(h) whichare the same as those of the laminated sheets 10 shown in FIGS. 7(a) to7(d) are denoted by the same reference characters and the descriptionthereof will be omitted.

Only a surface of the barrier layer 12, i.e., the aluminum foil, on theside of the heat-sealable layer 14 or both the surfaces of the barrierlayer 12 on the side of the base layer 11 and on the side of theheat-sealable layer 14, respectively, may be finished by a chemicalconversion treatment.

When the laminated sheet 10 is formed by a sandwich lamination processor a coextrusion lamination process, the laminated sheet 10 may besubjected to preheating or post heating to enhance adhesive strength.The liquid paraffin layer 19 improves the formability of the laminatedsheet and improves the crack resistance of the heat-sealable layer 14.

The formability of the laminated sheet 10 may be improved by coating atleast the surface of the base layer 11 with the slip coating layer 17 oferucamide, oleamide, bisoleamide or the like.

An embossed package 5 is formed by a method illustrated in FIGS. 6(a) to6(d). The laminated sheet 10 is subjected to press working on a pressprovided with a male mold 31 and a female mold 32 to form a case body 5a having a hollow part 7 and side walls 8. Sometimes, the case body 5 acannot be securely formed if the heat-sealable layer 14 of the laminatedsheet 10 does not slip satisfactorily on the male mold 31 of the press.When the heat-sealable layer 14 is coated with the liquid paraffin layer19, a part of the liquid paraffin layer 14 or the entire liquid paraffinlayer 14 permeates the heat-sealable layer 14 of a polypropylene resinor a polyethylene resin, and causes the heat-sealable layer 14 to swell.Consequently, the heat-sealable layer 14 becomes soft and extensible.

The liquid paraffin is a chain hydrocarbon oil having a specific gravityin the range of 0.83 to 0.87, a viscosity in the range of 7.6 to 80mm²/s at 37.5° C., a molecular weight in the range of about 300 to about500, and a distillation point under 10 mmHg in the range of 140 to 245°C. A liquid paraffin having a specific gravity of 0.83, a viscosity of7.7 mm²/s at 37.5° C., a molecular weight of 300, and a distillationpoint of about 145° C. under 10 mmHg is used preferably in the lithiumbattery packaging material of the present invention and by a method ofmaking the same lithium battery packaging material.

When the heat-sealable layer 14 is coated with the liquid paraffin layer19, stress induced in the heat-sealable layer 14 by an embossing processis distributed in the heat-sealable layer 14, so that cracking of theheat-sealable layer 14 of a polyolefin resin that occurs when thelaminated sheet 10 is embossed can be reduced or prevented. The liquidparaffin layer 19 exercises a lubricating effect to improve the slipcharacteristic of the heat-sealable layer 14.

The slip characteristic of the surface of the laminated sheet 10 isimproved and the formability of the laminated sheet 10 is improved byforming the slip coating layer 17 on the base layer 11 by applying asolution prepared by mixing a lubricant, such as erucamide, oleamide,stearamide, biserucamide, bisoleamide, bisstearamide or the like, and asolvent, such as isopropyl alcohol, ethyl acetate, toluene, methyl ethylketone or the like, to the surface of the base layer 11.

A cover 5 t is bonded to the case body 5 a formed by pressing as shownin FIGS. 6(a) to 6(d) to complete a package 5.

The inventors of the present invention made studies to develop alaminated sheet having a satisfactory emboss-formability, having a baselayer 12 and a barrier layer 12 which will not be delaminated, capableof intercepting moisture, and resistant to chemicals. The inventors havefound that a satisfactory laminated sheet 10 can be obtained byfinishing the opposite surfaces of a barrier layer 12, i.e., aluminumfoil, by a chemical conversion treatment, forming a bonding resin layer13 of an unsaturated carboxylic acid graft polyolefin resin and aheat-sealable layer 14 of a polyolefin resin on the inner surface 15 btreated by the chemical conversion treatment on the inner side ofpackage formed by using the laminated sheet 10 by a sandwich laminationprocess or a coextrusion process, and heating the laminated sheet 10.

The base layer 11 of the package 5 is an oriented polyester or nylonfilm. Possible polyester resins for forming the polyester film arepolyethylene terephthalate resins, polybutylene terephthalate resins,polyethylene naphthalate resins, polybutylene naphthalate resins,polyester interpolymers, polycarbonate resins and the like. Possiblepolyimide resins for forming the nylon film are nylon 6, nylon 66,copolymers of nylon 6 and nylon 66, nylon 610, polymethaxylileneadipamide (MXD6) and the like.

When the laminated sheet 10 is used for forming the package 5 of thelithium battery, the base layer 11 comes into direct contact withhardware. Therefore, it is preferable that the base layer 11 isbasically insulating. When the polymer battery is used on a piece ofhardware, the base layer 21 comes into direct contact with the piece ofhardware. Therefore, it is basically desirable to form the base layer 21of an intrinsically insulating resin. Since a film forming the baselayer 11 has pinholes and pinholes will be formed in the film duringprocessing, the thickness of the base layer 11 must be 6 μm or above,preferably, in the range of 12 to 30 μm.

The base layer 11 may be a laminated film in view of providing the baselayer 11 with pinhole resistance and improved insulating ability.

A laminated film for the base layer 11 includes at least one resin layerconsisting of two or more layers each having a thickness of 6 μm orabove, preferably, in the range of 12 to 25 μm. The following laminatedstructures 1) to 8) are examples of the laminated base layer 21.

1) Oriented polyethylene terephthalate resin layer/Oriented nylon layer

2) Oriented nylon layer/Oriented polyethylene terephthalate resin layer

To improve the mechanical aptitude (stability when passed throughprocessing machines and a packaging machine) and surface protectingability (heat resistance and electrolyte resistance) of the packagingsheet 10 and to reduce friction between a die and the base layer 11 whenembossing the laminated sheet 10, it is preferable that the base layerconsists of plural layers and the surface of the base layer is coatedwith a slip coating layer 17 of a fluorocarbon resin, an acrylic resin,a silicone resin, a polyester resin or a blend of some of those resins.The followings are combinations of a base layer 11 and a slip coatinglayer 17.

3) Fluorocarbon resin layer/Oriented polyethylene terephthalate resinlayer (The fluorocarbon resin layer may be a fluorocarbon resin film ora film formed by spreading a liquid fluorocarbon resin in a film anddrying the same.)

4) Silicone resin layer/Oriented polyethylene terephthalate resin layer(The silicone resin layer may be a silicone resin film or a film formedby spreading a liquid silicone resin in a film and drying the same.)

5) Fluorocarbon resin layer/Oriented polyethylene terephthalate resinlayer/Oriented nylon layer

6) Silicone resin layer/Oriented polyethylene terephthalate resinlayer/Oriented nylon layer

7) Acrylic resin layer/Oriented nylon layer (The acrylic resin layer maybe an acrylic resin film or a film formed by spreading an acrylic resinand drying the same.)

8) Acrylic resin+polysiloxane graft acrylic resin layer/Oriented nylonlayer (The acrylic resin layer may be a film of an acrylic resin or afilm formed by spreading an acrylic resin and drying the same.)

The barrier layer 12 prevents the penetration of moisture into thelithium battery. To stabilize the workability (ease of fabricatingpouches or embossing) and to provide the barrier layer 12 with pinholeresistance, the barrier layer 12 has a thickness of 15 μm or above andis formed from a metal foil, such as an aluminum foil or a nickel foil,or a film coated with an inorganic compound, such as silicon dioxide oralumina, by evaporation. Preferably, the barrier layer 12 is an aluminumfoil of a thickness in the range of 20 to 80 μm.

To prevent the creation of pinholes and cracks in an embossed package,aluminum having an iron content in the range of 0.3 to 9.0% by weight,preferably, 0.7 to 2.0% by weight, is used for forming the barrier layer12. Aluminum having such an iron content is more satisfactory inductility than aluminum not containing any iron, the barrier layer 12 ofaluminum having such an iron content is not likely to have pinholes whenthe laminated sheet 10 is bent and is more capable of facilitatingforming the side walls 8 of the embossed package 5 than a barrier layerof aluminum not containing any iron. A barrier layer of aluminum havingan iron content less than 0.3% by weight is not satisfactorilypinhole-resistant and do not improve the formability of the laminatedsheet. A barrier layer of aluminum having an iron content exceeding 0.9%by weight is unsatisfactory in flexibility and affects adversely theworkability of the laminated sheet in forming a pouch.

The flexibility, stiffness and hardness of an aluminum foil formed bycold rolling are dependent on annealing conditions. The presentinvention uses rather soft, slightly or completely annealed aluminumfoils.

Annealing conditions that affect the flexibility, stiffness and hardnessof aluminum foils may be properly determined according to the requiredworkability (ease of forming pouches or embossed packages) of thelaminated sheet. For example, to prevent the formation of creases orpinholes in making a package by an embossing process, it is desirable touse a soft aluminum foil properly annealed according to the degree offorming.

The inventors of the present invention found through studies that asatisfactory laminated sheet 10 as a lithium battery packaging materialcan be formed by using an aluminum foil having opposite surfaces coatedwith chemically converted coatings 15 a and 15 b formed by a chemicalconversion treatment as the barrier layer 12. The chemical conversiontreatment forms the chemically converted coatings 15 a and 15 b, i.e.,acid-resistant films, of a phosphate, a chromate, a fluoride or atriazine thiol compound. Thus the separation of the barrier layer 12from the base layer 11 during an embossing process can be prevented, andthe dissolution and corrosion of the surfaces of the barrier layer 12 ofaluminum by hydrogen fluoride produced by the interaction of theelectrolyte of the lithium battery 1 and moisture can be prevented.Particularly, the dissolution and corrosion of aluminum oxide layerscoating the surfaces of the aluminum foil can be prevented, the adhesiveproperty (wettability) of the surfaces of the aluminum foil can beimproved, the separation of the barrier layer 12 of aluminum from thebase layer 11 can be prevented and the separation of the barrier layer12 of aluminum and the inner layer due to the effect of hydrogenfluoride produced by the interaction of the electrolyte and moisture canbe prevented by the chemical conversion treatment of the barrier layer12 of aluminum.

It was found through experimental chemical conversion treatment usingvarious substances that a chemical conversion treatment method using amixture of a phenolic resin, a chromium fluoride (3) compound andphosphoric acid has satisfactory effect.

Preferably, the chemical conversion treatment uses a processing materialprepared by adding a metal, such as molybdenum, titanium or zirconium,or a metal salt to a resin containing at least a phenolic resin.

When the package 5 of the lithium battery 1 is an embossed package, thedelamination of the barrier layer 12 of aluminum and the base layer 11during an embossing process can be prevented by finishing both thesurfaces of the barrier layer 12 of aluminum by a chemical conversiontreatment.

The inventors have found through assiduous studies to establish alaminating method capable of bonding component layers of a laminatedsheet by high bond strength that, when fabricating a laminated sheet 10by bonding a base layer 11 to one of the chemically converted surfacesof a barrier layer 12 by dry lamination, and extruding a bonding resinlayer 13 of an acid-modified polyolefin resin on the other surface ofthe barrier layer 12 and laminating a heat-sealable layer 14, such as apolyethylene or polypropylene film to the barrier layer 12 by sandwichlamination, or when fabricating a laminated sheet 10 by laminating abonding resin layer 13 of an acid-modified polyethylene resin and aheat-sealable layer 14 of a polyethylene resin of a polypropylene resinby coextrusion, the component layers of the laminated sheet 10 can bebonded together by desired bond strength by heating the laminated sheet10 such that the acid-modified polyolefin resin is heated attemperatures not lower than its softening point.

The laminated sheet 10 may be heated by any suitable heating method,such as a heated roller contact heating method, heated air heatingmethod or a far infrared heating method, provided that the bonding resinlayer can be heated at temperatures not lower than its softening point.

Another method of fabricating a laminated sheet 10 consisting of layersbonded together by stable bonding strength is to heat a surface of abarrier layer 12 of aluminum on the side of a heat-sealable layer 14 ata temperature corresponding to the softening point of an acid-modifiedpolyolefin resin during a sandwich lamination process or a coextrusionlamination process.

The bonding resin layer 13 may be formed of a polyethylene resin. Whenthe bonding resin layer 13 is formed of a polyethylene resin, a surfaceof a molten polyethylene resin film on the side of the barrier layer 12of aluminum is processed by ozone before laminating the moltenpolyethylene resin film to the barrier layer 12.

The component layers 21, 22 and 23 of the lead-insulating film 6 may beprocessed by a surface activating treatment, such as a corona dischargetreatment, a blasting treatment, an oxidation treatment or an ozonetreatment, to improve and stabilize aptitudes for film formation,lamination and fabrication (pouch formation and embossing).

The heat-sealable layer 14 of the package 5 may be a single-ply layer ora multi-ply layer of one or a blend of some of propylene resins (homopolymers or ethylene-propylene copolymers and ethylene-propylene-buteneterpolymers), ethylene resins (low-density polyethylene resins,middle-density polyethylene resins, high-density polyethylene resins,linear low-density polyethylene resins, ethylene-butene copolymers,copolymers of ethylene, and acrylic acid or a methacrylic acidderivative, ethylene-vinyl acetate copolymers, and graft polyethylene orpolypropylene resins of a metal-ion-containing polyethylene resin andunsaturated carboxylic acid.

The material of the heat-sealable layer 14 or the bonding resin layer 13may contain butene, an ethylene-butene-propylene terpolymers, a lowcrystalline ethylene-butene copolymer having a density of 900 kg/m³, anamorphous ethylene-propylene copolymer, or a propylene-α-olefincopolymer.

A dry lamination process, a sandwich lamination process, a coextrusionlamination process and thermal lamination process may be used forforming the laminated sheet 10 for forming the package 5.

EXAMPLES

Examples of the lead-insulating film 6 will be described.

When processing barrier layers 12 of packages 5 in both examples andcomparative examples by a chemical conversion treatment, an aqueoussolution containing a phenolic resin, a chromium fluoride (3) compoundand phosphoric acid was used as a processing liquid. The processingliquid was applied in a film to the barrier layer 12 by a roll coatingmethod, and the film of the processing liquid was baked at 180° C. orabove. The chromium content of the film was 2 mg/m² (dry spread).

In the examples and comparative examples, pouches 5 were 30 mm wide and50 mm long (inside measurements), and embossed packages 5 weresingle-hollow embossed packages having a hollow part of 30 mm in width,50 mm in length and 3.5 mm in depth. Laminated sheets were pressed forformability evaluation.

Example 1 (Pouch)

Both the surfaces of a 20 μm thick aluminum foil (barrier layer 12) wereprocessed by the chemical conversion treatment. A 12 μm thick orientedpolyester film (base layer 11) was laminated to one of the surfaces ofthe aluminum foil by a dry lamination process. The other chemicallyconverted surface of the aluminum foil was heated at a temperature notlower than the softening point of an acid-modified polyethylene resin(unsaturated carboxylic acid graft polyethylene resin), i.e., a bondingresin, with infrared radiation and hot air, and a 20 μm thick bondingresin layer 13 of the acid-modified polyethylene resin (unsaturatedcarboxylic acid graft polyethylene resin), and a 30 μm thick linearlow-density polyethylene resin film as a heat-sealable layer 14 werelaminated to the barrier layer 12 by a sandwich lamination process toobtain a laminated sheet 10. Pillow-type pouches were made from thelaminated sheet 10.

A lead-insulating film 6 was made by laminating a 50 μm thickethylene-methacrylic acid copolymer film (EMAA film) to one surface of a12 μm thick PET film (biaxially oriented polyester film) (base film 22)after coating the same surface with an isocyanate anchor coating, by anextrusion lamination process, and laminating a 50 μm thick EMAA film tothe other surface of the PET film after coating the same surface with anisocyanate anchor coating.

The lead-insulating films 6 were bonded temporarily to the upper and thelower surface of a 100 μm thick, 4 mm wide lead 4 of aluminum, the leadwas inserted in the pouch 5, and the pouch 5 was heat-sealed underheat-sealing conditions including a heating temperature of 190° C., apressure of 1.0 MPa and a heating time of 3.0 s to obtain a test samplein Example 1.

Example 2 (Pouch)

Both the surfaces of a 20 μm thick aluminum foil were processed by thechemical conversion treatment. A 12 μm thick oriented polyester film waslaminated to one of the surfaces of the aluminum foil by a drylamination process. The other chemically converted surface of thealuminum foil was heated at a temperature not lower than the softeningpoint of an acid-modified polypropylene resin, i.e., a bonding resin,with infrared radiation and hot air, and a 20 μm thick bonding resinlayer of the acid-modified polypropylene resin (unsaturated carboxylicacid graft polyethylene resin), and a 30 μm thick linear low-densitypolyethylene resin film as a heat-sealable layer were laminated to thebarrier layer by a sandwich lamination process to obtain a laminatedsheet 10. Pillow-type pouches were made from the laminated sheet 10.

A lead-insulating film 6 was made by laminating a 20 μm thickpolypropylene resin film to one surface of a 12 μm thick PEN film(biaxially oriented polyethylene naphthalate film) by an extrusionlamination process after coating the same surface with an imine anchorcoating, and laminating a 10 μm thick acid-modified polypropylene resinfilm to the other surface of the PET film after coating the same surfacewith an imine anchor coating.

The lead-insulating films 6 were bonded temporarily to the upper and thelower surface of a 100 μm thick, 4 mm wide lead 4 of aluminum such thatthe acid-modified polypropylene resin layers face the lead, the lead wasinserted in the pouch, and the pouch was heat-sealed under heat-sealingconditions including a heating temperature of 190° C., a pressure of 1.0MPa and a heating time of 3.0 s to obtain a test sample in Example 2.

Example 3 (Pouch)

One of the surfaces of a 20 μm thick aluminum foil was processed by thechemical conversion treatment. A 12 μm thick oriented polyester film waslaminated to the other surface not processed by the chemical conversiontreatment of the aluminum foil a dry lamination process. The chemicallyconverted surface of the aluminum foil was heated at a temperature notlower than the softening point of an acid-modified polypropylene resin(unsaturated carboxylic acid graft polyethylene resin) with infraredradiation and hot air, and a 20 μm thick bonding resin layer of theacid-modified polyethylene resin, and a 100 μm thick linear low-densitypolyethylene resin film as a heat-sealable layer were laminated to thebarrier layer by a sandwich lamination process to obtain a laminatedsheet 10. Pillow-type pouches were made from the laminated sheet 10.

A lead-insulating film 6 was made by laminating a 20 μm thickethylene-acrylic acid copolymer film (EAA film) to one surface of a 6 μmthick PPS film (polyphenylene sulfide film) by an extrusion laminationprocess after coating the same surface with an organic titanium anchorcoating, and laminating a 40 μm thick acid-modified polypropylene resinfilm (EAA) to the other surface of the PPS film after coating the samesurface with an organic titanium anchor coating.

The lead-insulating films 6 were bonded temporarily to the upper and thelower surface of a 100 μm thick, 10 mm wide lead 4 of aluminum, and thepouch was heat-sealed under heat-sealing conditions including a heatingtemperature of 190° C., a pressure of 2.0 MPa and a heating time of 3.0s to obtain a test sample in Example 3

Example 4 (Embossed Package)

Both the surfaces of a 40 μm thick aluminum foil were processed by thechemical conversion treatment. A 25 μm thick oriented nylon film waslaminated to one of the surfaces of the aluminum foil by a drylamination process. Then, a primary laminated sheet was formed bylaminating a 30 μm thick linear low-density polyethylene resin filmhaving a density of 0.921 to the other chemically converted surface ofthe aluminum foil by using a 20 μm thick acid-modified polyethyleneresin film (unsaturated carboxylic acid graft polyethylene) as a bondinglayer by a sandwich lamination process. The primary laminated sheet washeated at a temperature not lower than the softening point of theacid-modified polyethylene resin with hot air to obtain a secondarylaminated sheet. Embossed case bodies were formed by embossing thesecondary laminated sheet, and covers were formed by cutting thesecondary laminated sheet.

A lead-insulating film 6 was made by laminating a 20 μm thick linearlow-density polyethylene resin film to one surface of an 50 μm thick TPXfilm (polymethyl pentene resin film) by an extrusion lamination processafter coating the same surface with an imine anchor coating, andlaminating a 100 μm thick acid-modified polyethylene resin film(unsaturated carboxylic acid graft polyethylene resin film) to the othersurface of the TPX film after coating the same surface with anisocyanate anchor coating.

The lead-insulating films were welded to the upper and the lower surfaceof a 200 μm thick, 10 mm wide lead of aluminum such that the unsaturatedcarboxylic acid graft polyethylene resin films face the lead, the leadwas inserted in the embossed package, and the embossed package washeat-sealed under heat-sealing conditions including a heatingtemperature of 190° C., a pressure of 1.0 MPa and a heating time of 5.0s to obtain a test sample in Example 4.

Example 5 (Embossed Package)

Both the surfaces of a 40 μm thick aluminum foil were processed by thechemical conversion treatment. A 25 μm thick oriented nylon film waslaminated to one of the surfaces of the aluminum foil by a drylamination process. Then, a primary laminated sheet was formed bylaminating a 30 μm thick propylene resin film having a density of 0.921to the other chemically converted surface of the aluminum foil by usinga 15 μm thick acid-modified polypropylene resin film (unsaturatedcarboxylic acid graft polypropylene film) as a bonding layer by asandwich lamination process. The primary laminated sheet was heated at atemperature not lower than the softening point of an acid-modifiedpolyethylene resin with hot air to obtain a secondary laminated sheet.Embossed case bodies were formed by embossing the secondary laminatedsheet, and covers were formed by cutting the secondary laminated sheet.

A lead-insulating film 6 was made by laminating a 20 μm thickpolypropylene resin film to one surface of an 80 μm thick POM film(polyacetal resin film) by an extrusion lamination process after coatingthe same surface with an isocyanate anchor coating, and laminating a 50μm thick acid-modified polypropylene resin film (unsaturated carboxylicacid graft polypropylene resin film) to the other surface of the POMfilm by an extrusion lamination process after coating the same surfacewith an isocyanate anchor coating.

The lead-insulating films 6 were welded to the upper and the lowersurface of a 100 μm thick, 6.0 mm wide lead of aluminum such that theunsaturated carboxylic acid graft polypropylene resin films face thelead, the lead was inserted in the embossed package, and the embossedpackage was heat-sealed under heat-sealing conditions including aheating temperature of 190° C., a pressure of 2.0 MPa and a heating timeof 10 s to obtain a test sample in Example 5.

Example 6 (Embossed Package)

Both the surfaces of a 40 μm thick aluminum foil were processed by thechemical conversion treatment. A 25 μm thick oriented nylon film waslaminated to one of the surfaces of the aluminum foil by a drylamination process. Then, a 30 μm thick linear low-density polyethyleneresin film having a density of 0.921 was laminated to the otherchemically converted surface of the aluminum foil by a dry laminationprocess to obtain a laminated sheet. Embossed case bodies were formed byembossing the laminated sheet, and covers were formed by cutting thelaminated sheet.

A lead-insulating film 6 was made by laminating a 20 μm thick linearlow-density polyethylene resin film to one surface of a 40 μm thickcyclic polyolefin rein film by an extrusion lamination process aftercoating the same surface with a polyethylene imine anchor coating, andlaminating a 50 μm thick acid-modified polyethylene resin film(unsaturated carboxylic acid graft polyethylene resin film) to the othersurface of the cyclic polyolefin resin film by an extrusion laminationprocess after coating the same surface with a polyethylene imine anchorcoating.

The lead-insulating films were welded to the upper and the lower surfaceof a 100 μm thick, 4 mm wide lead of aluminum such that theethylene-methacrylic acid copolymer films face the lead, the lead wasinserted in the embossed package, and the embossed package washeat-sealed under heat-sealing conditions including a heatingtemperature of 190° C., a pressure of 1.0 MPa and a heating time of 5.0s to obtain a test sample in Example 6.

Example 7 (Pouch)

Both the surfaces of a 20 μm thick aluminum foil were processed by thechemical conversion treatment. A 12 μm thick oriented polyester film waslaminated to one of the surfaces of the aluminum foil by a drylamination process. Then, the other surface of the chemically convertedsurface of the aluminum foil was heated at a temperature not lower thanthe softening point of an acid-modified polyethylene resin (unsaturatedcarboxylic acid graft polyethylene resin) i.e., a bonding resin, withinfrared radiation and hot air, and a 30 μm thick linear low-densitypolyethylene resin film, i.e., a heat-sealable layer, was laminated tothe other chemically converted surface of the aluminum foil with a 20 μmthick acid-modified polyethylene resin film by a sandwich laminationprocess to obtain a laminated sheet. Pillow type pouches were made fromthe laminated sheet.

A lead-insulating film 6 was made by laminating a 60 μm thickethylene-methacrylic acid copolymer film (EMAA FILM) to one surface of a30 μm thick biaxially oriented polypropylene resin film (OPP film) by anextrusion lamination process after coating the same surface with anisocyanate anchor coating, and laminating a 60 μm thick EMAA film to theother surface of the EMAA film by an extrusion lamination process aftercoating the same surface with am isocyanate anchor coating.

The lead-insulating films were welded to the upper and the lower surfaceof a 100 μm thick, 4 mm wide lead of aluminum such that theacid-modified polyethylene resin layers face the lead, the lead wasinserted in the pouch, and the pouch was heat-sealed under heat-sealingconditions including a heating temperature of 190° C., a pressure of 1.0MPa and a heating time of 3.0 s to obtain a test sample in Example 7.

Comparative Example 1 (Pouch)

Both the surfaces of a 20 μm thick aluminum foil were processed by achemical conversion treatment. A 12 μm thick oriented polyester film waslaminated to one of the surfaces of the aluminum foil by a drylamination process. The other chemically converted surface of thealuminum foil was heated at a temperature not lower than the softeningpoint of an acid-modified polyethylene resin, i.e., a bonding resin,with infrared radiation and hot air, and a 20 μm thick acid-modifiedpolyethylene resin film (unsaturated carboxylic acid graft polyethyleneresin film), and a 30 μm thick linear low-density polyethylene resinfilm as a heat-sealable layer were laminated to the aluminum foil by asandwich lamination process to obtain a laminated sheet. Pillow-typepouches were made from the laminated sheet.

A 50 μm thick acid-modified polyethylene resin film (unsaturatedcarboxylic acid graft polyethylene resin film) was used as alead-insulating film.

The lead-insulating films were bonded temporarily to the upper and thelower surface of a 100 μm thick, 4 mm wide lead of aluminum, the leadwas inserted in the pouch, and the pouch was heat-sealed underheat-sealing conditions including a heating temperature of 190° C., apressure of 1.0 MPa and a heating time of 2.5 s to obtain a test samplein Comparative example 1.

Comparative Example 2 (Pouch)

Both the surfaces of a 20 μm thick aluminum foil were processed by achemical conversion treatment. A 12 μm thick oriented polyester film waslaminated to one of the surfaces of the aluminum foil by a drylamination process. The other chemically converted surface of thealuminum foil was heated at a temperature not lower than the softeningpoint of an acid-modified polypropylene resin, i.e., a bonding resin,with infrared radiation and hot air, and a 20 μm thick acid-modifiedpolypropylene resin film (unsaturated carboxylic acid graftpolypropylene resin film) as a bonding resin layer, and a 100 μm thickpolypropylene resin film as a heat-sealable layer were laminated to thealuminum foil by a sandwich lamination process to obtain a laminatedsheet. Pillow-type pouches were made from the laminated sheet.

A 200 μm thick polypropylene-base acid-modified polypropylene resin film(unsaturated carboxylic acid graft polypropylene resin film) was used asa lead-insulating film.

The lead-insulating films were bonded temporarily to the upper and thelower surface of a 100 μm thick, 4 mm wide lead of aluminum, the leadwas inserted in the pouch, and the pouch was heat-sealed underheat-sealing conditions including a heating temperature of 190° C., apressure of 2.0 MPa and a heating time of 3.0 s to obtain a test samplein Comparative example 2.

Comparative Example 3 (Embossed Package)

Both the surfaces of a 40 μm thick aluminum foil were processed by achemical conversion treatment. A 25 μm thick oriented nylon film waslaminated to one of the surfaces of the aluminum foil by a drylamination process. A 20 μm thick acid-modified polyethylene resin film(unsaturated carboxylic acid graft polyethylene resin film) as a bondingresin layer, and a 30 mm thick linear low-density polyethylene resinfilm having a density of 0.921 were laminated to the other chemicallyconverted surface of the aluminum foil by a sandwich lamination processto obtain a primary laminated sheet. The primary laminated sheet washeated at a temperature not lower than the softening point of theacid-modified polyethylene resin. Embossed case bodies were formed byembossing the primary laminated sheet, and covers were formed by cuttingthe primary laminated sheet.

A 200 μm thick acid-modified polyethylene resin film (unsaturatedcarboxylic acid graft polyethylene resin film) was used as alead-insulating film.

The lead-insulating films were bonded temporarily to the upper and thelower surface of a 200 μm thick, 4 mm wide lead of aluminum, the leadwas inserted in the embossed package, and the embossed package washeat-sealed under heat-sealing conditions including a heatingtemperature of 190° C., a pressure of 1.0 MPa and a heating time of 5 sto obtain a test sample in Comparative example 3.

Comparative Example 4 (Embossed Package)

Both the surfaces of a 40 μm thick aluminum foil were processed by achemical conversion treatment. A 25 μm thick oriented nylon film waslaminated to one of the surfaces of the aluminum foil by a drylamination process. A 20 μm thick acid-modified polypropylene resin film(unsaturated carboxylic acid graft polypropylene resin film) as abonding resin layer, and a 30 μm thick propylene resin film having adensity of 0.921 were laminated to the other chemically convertedsurface of the aluminum foil by a sandwich lamination process to obtaina primary laminated sheet. The primary laminated sheet was heated at atemperature not lower than the softening point of the acid-modifiedpolypropylene resin. Embossed case bodies were formed by embossing theprimary laminated sheet, and covers were formed by cutting the primarylaminated sheet.

A 100 μm thick acid-modified polypropylene resin film (unsaturatedcarboxylic acid graft polypropylene resin film) was used as alead-insulating film.

The lead-insulating films were bonded temporarily to the upper and thelower surface of a 100 μm thick, 4 mm wide lead of aluminum, the leadwas inserted in the embossed package, and the embossed package washeat-sealed under heat-sealing conditions including a heatingtemperature of 190° C., a pressure of 0.2 MPa and a heating time of 10 sto obtain a test sample in Comparative example 4.

Method of Evaluation

(1) Contact Between Lead and Barrier Layer

A part of the lead in a heat-sealed part of the package was cut, and aphotograph of a section of the lead was observed to examine thecondition of the lead relative to the package. A circuit analyzer wasused to confirm the condition of the lead relative to the barrier layerof the package when it is difficult to determine visually whether or notthe lead was in contact with the barrier layer of the package. It wasdecided that the lead is barely apart from the barrier layer when anyfilm was not found between the lead and the barrier layer of the packagein the photograph. Test samples which were determined throughexamination using the circuit analyzer that their leads were in contactwith the barrier layers were examined.

(2) Leakage

Sample packages were examined for the leakage of an electrolyte 1M LiPF₆contained in the packages through gaps around the lead after keeping thepackages in an environment of 80° C. for 24 h. The electrolyte was a1:1:1 mixture of ethylene carbonate, diethyl carbonate and dimethylcarbonate. Three grams of the electrolyte was contained in each samplepackage.

Results

Contact between the lead and the barrier layer and the leakage of theelectrolyte were not found at all in the test samples in Examples 1 to7.

The leads of eighty test samples among the one hundred test samples inComparative example 1 were virtually in contact with the barrier layers,and those of sixty test samples were actually in contact with thebarrier layers. Leakage was not found in all the test samples inComparative example 1.

The leads of fifty test samples among the one hundred test samples inComparative example 2 were virtually in contact with the barrier layers,and those of forty test samples were actually in contact with thebarrier layers. Leakage was not found in all the test samples inComparative example 2.

The leads of eighty test samples among the one hundred test samples inComparative example 3 were actually in contact with the barrier layers.Leakage was not found in all the test samples in Comparative example 3.

The leads of sixty test samples among the one hundred test samples inComparative example 4 were virtually in contact with the barrier layers,and those of forty test samples were actually in contact with thebarrier layers. Leakage was not found in all the test samples inComparative example 4.

Both the test samples in Examples and those in Comparative examples weresatisfactory in other test items other than contact between the lead andthe barrier layer.

According to the present invention, a battery module is put in apackage, a peripheral part of the package is heat-sealed to seal thebattery module in the package. Lead-bonding films are interposed betweenthe leads of the battery module and the package. The lead-insulatingfilm is formed by laminating a polyolefin resin layer and anacid-modified polyolefin resin layer laminated to both the surfaces of aheat-resistant base film, respectively, by extrusion laminationprocesses after coating both the surfaces of the heat-resistant basefilm with anchor coatings, respectively. The barrier layer of thepackage does not come into contact with the leads when the package issealed, and contents of the package do not leak.

The chemical conversion treatment of both the surfaces of the barrierlayer of aluminum of the package prevents the delamination of the baselayer and the barrier layer of aluminum when the laminated sheet issubjected to embossing and when the package is heat-sealed. Thecorrosion of the surfaces of the barrier layer of aluminum by hydrogenfluoride produced by the interaction of the electrolyte of the lithiumbattery and moisture can be prevented. The delamination of the barrierlayer of aluminum and the layer on the inner side of the barrier layercan be prevented.

Second Embodiment

A second embodiment of the present invention will be described withreference to FIG. 10. The second embodiment shown in FIG. 10 issubstantially the same as the first embodiment shown in FIGS. 1 to 8,except that the second embodiment differs from the first embodiment inthe construction of a lead-insulating film 6. In FIG. 10 parts like orcorresponding to those shown in FIGS. 1 to 8 are denoted by the samereference characters and the description thereof will be omitted.

Referring to FIGS. 10(a) and 10(b), a lead-insulating film 6 isinterposed between a lead (tab) 4 of a metal and a heat-sealable layer14 included in a laminated sheet 10 forming a package 5. Thelead-insulating film 6 is capable of being bonded to both the lead 4 andthe heat-sealable layer 14 by heat-sealing. To enable thelead-insulating film 6 to maintain an insulating effect under heat andpressure applied thereto for heat-sealing, the lead-bonding film 6 is afilm consisting of at least a polyolefin resin layer 21, an adhesivepolymethyl pentene resin layer 22 a and an acid-modified polyolefinresin layer 23, and formed by coextrusion.

The polyolefin resin layer 21 of the lead-insulating film (adhesivefilm) 6 is formed of a polyethylene resin or a polypropylene resincontaining ethylene when the heat-sealable layer 14 is formed of apolyethylene resin, or is formed of a polypropylene resin or an ethyleneresin containing propylene when the heat-sealable layer 14 of thepackage 5 is formed of a polypropylene resin.

The acid-modified polyolefin resin layer 23 of the lead-insulating film6 can be bonded to the lead (tab) 4 by thermal bonding. Possible resinsfor forming the acid-modified polyolefin resin layer 23 are unsaturatedcarboxylic acid graft polyolefin resins, metal-crosslinked polyethyleneresins, acid-modified polyethylene resins, such as copolymers ofethylene or propylene, and acrylic acid or methacrylic acid, andacid-modified polypropylene resins. When necessary, the acid-modifiedpolyolefin resin layer 23 may contain 5% or more butene, an ethyleneterpolymer, butene and propylene, a low crystalline ethylene-butenecopolymer having a density of 900 kg/m³, an amorphous ethylene-propylenecopolymer or a propylene-α-olefin copolymer.

The lead-insulating film 6 of the present invention is a three-layerfilm formed by coextrusion. The adhesive polymethyl pentene resin layer(adhesive TPX layer) 22 a is the middle layer of the lead-insulatingfilm 6. An adhesive TPX resin forming the adhesive polymethyl penteneresin layer 22 a is highly adhesive to a polyolefin resin when used forcoextrusion in combination with a polyolefin resin, and has a meltingpoint higher than the melting points of polyolefin resins in the rangeof 80 to 160° C. and the melting points of acid-modified polyolefinresins in the range of 75 to 160° C. Therefore, the adhesive polymethylpentene resin layer 22 a of the adhesive TPX is not crushed by heat andpressure applied thereto during heat-sealing and maintains its functionas an insulating layer, while the polyolefin resin layer and theacid-modified polyolefin resin layer are crushed thin.

The TPX resin is prepared by mixing a trimethyl pentene resin having amelting point of 180° C. or above, and 10 to 60% tackifier. Possibletackfiers are terpene resins (terpene phenol resins, aromatic modifiedresins and hydrogenated resins), rosin derivatives (hydrogenation,disproportionation, dimerization, esterification), cycloaliphaticsaturated hydrocarbon resins, limonene resins, alkylphenol resins,xylene resins and coumarone-indene resins.

The lead-insulating film 6 of the present invention is a three-layerfilm consisting of a polyolefin resin layer 21, an adhesive TPX layer 22a and an acid-modified polyolefin resin layer 23 formed by coextrusion.The weight ratio of those layers 21, 22 a and 23 is about (1 to 4):(2 to8):(1 to 4). The thickness f the adhesive TPX layer 22 a must be 10 μmor above. If the thickness of the adhesive TPX layer 22 a is less than10 μm, the insulating effect of the adhesive TPX layer 22 a will be lostwhen heat and pressure is applied thereto for heat-sealing. Desirably,the thickness of the adhesive lead-insulating film 6, i.e., thethree-layer coextruded structure, is ⅙ of the thickness of a lead (tab)4 to which the lead-insulating film 6 is to be attached.

When the package 5 is sealed with the lead-insulating film 6 of thepresent invention held between the package 5 and the lead 4 to form aheat-sealed part 9, the adhesive TPX layer 22 remains between thebarrier layer 12 of the package 5 and the lead 4 in the heat-sealed part9 as shown in FIG. 1 (d), and serves as an insulating layer forisolating the barrier layer 12 from the lead 4.

The lead-insulating film 6 of the present invention has the polyolefinresin layer 21, the adhesive TPX layer 22 a and the acid-modifiedpolyolefin resin layer 23. The polyolefin resin layer 21 needs to weldto the heat-sealable layer 14 of the package 5. The polyolefin resinlayer 21 of the lead-insulating film 6 is formed of a polyethylene resinwhen the heat-sealable layer 14 is formed of a polyethylene resin. Thepolyolefin resin layer 21 of the lead-insulating film 6 is formed of apolypropylene resin when the heat-sealable layer 14 is formed of apolypropylene resin.

Generally, the adhesive TPX layer 22 a, i.e., the middle layer, of thelead-insulating film 6 does not weld satisfactorily to a polyolefinresin layer. The weldability of the adhesive TPX layer 22 a can beimproved by adding 10 to 60% tackifier to the material of the adhesiveTPX layer 22 a without depriving the adhesive TPX layer 22 a of heatresistance.

The acid-denatured polyolefin resin layer 23 of the lead-insulating film6 welds closely to the lead 4 to prevent the entrance of moisture intothe package 5 and the leakage of the component of the battery module 2contained in the package 5. The acid-modified polyolefin resin layer 23protects the surface of the lead 4 from the corrosive action of hydrogenfluoride (HF) produced by the interaction of the electrolyte of thebattery module 2 and moisture. The acid-modified polyolefin resin layer23 may be formed of either a polyethylene resin or a polypropyleneresin.

When the lead-insulating films 6 are placed between the package 5 andthe leads 4 and the package 5 is sealed, the adhesive TPX layers 22 a ofthe lead-insulating films 6 remain between the barrier layers 12 of thepackage 5 and the leads 4 as shown in FIG. 10(d), and serve asinsulating layers for preventing accidental contact between the barrierlayers 12 and the leads 4.

The component layers 21, 22 and 23 ofthe lead-insulating film 6 may beprocessed by a surface activating treatment, such as a corona dischargetreatment, a blasting treatment, an oxidation treatment or an ozonetreatment, to improve and stabilize aptitudes for film formation,lamination and fabrication (pouch formation and embossing).

EXAMPLES

Examples of the lead-insulating film 6 will be described.

When processing barrier layers 12 of packages 5 in both examples andcomparative examples by a chemical conversion treatment, an aqueoussolution containing a phenolic resin, a chromium fluoride (3) compoundand phosphoric acid was used as a processing liquid. The processingliquid was applied in a film to the barrier layer 12 by a roll coatingmethod, and the film of the processing liquid was baked at 180° C. orabove. The chromium content of the film was 2 mg/m² (dry weight).

In the examples and comparative examples, pouches 5 were 30 mm wide and50 mm long (inside measurements), and embossed packages 5 weresingle-hollow embossed packages having a hollow part of 30 mm in width,50 mm in length and 3.5 mm in depth. Laminated sheets were pressed forformability evaluation.

Example 1 (Pouch)

Both the surfaces of a 20 μm thick aluminum foil (barrier layer 12) wereprocessed by the chemical conversion treatment. A 12 μm thick orientedpolyester film (base layer 11) was laminated to one of the surfaces ofthe aluminum foil by a dry lamination process. The other chemicallyconverted surface of the aluminum foil was heated at a temperature notlower than the softening point of an acid-modified polyethylene resin,i.e., a bonding resin, with infrared radiation and hot air, and a 20 μmthick acid-modified polyethylene resin film as a bonding resin layer 13and a 30 μm thick linear low-density polyethylene resin film as aheat-sealable layer 14 were laminated to the barrier layer 12 by asandwich lamination process to obtain a laminated sheet 10. Pillow-typepouches were made from the laminated sheet 10.

A lead-insulating film 6 was made. The lead-insulating film 6 was a 30μm thick laminated film formed by laminating a 10 μm thick linearlow-density polyethylene resin layer (polyolefin resin layer 21), a 10μm thick adhesive TPX layer 22 a having a melting point of 190° C., anda 10 μm thick acid-modified polyethylene resin layer of an unsaturatedcarboxylic acid graft polyethylene resin by a coextrusion process.

The lead-insulating films 6 were bonded temporarily to the upper and thelower surface of a 100 μm thick, 4 mm wide lead 4 of aluminum such thatthe acid-modified polyethylene resin layers face the lead 4, the lead 4was inserted in the pouch 5, and the pouch 5 was heat-sealed underheat-sealing conditions including a heating temperature of 190° C., apressure of 1.0 MPa and a heating time of 3.0 s to obtain a test samplein Example 1.

Example 2 (Pouch)

One surface of a 20 μm thick aluminum foil to be on the side of theheat-sealable layer was processed by the chemical conversion treatment.A 12 μm thick oriented polyester film was laminated to the other surfacenot processed by the chemical conversion treatment of the aluminum foilby a dry lamination process. The chemically converted surface of thealuminum foil was heated at a temperature not lower than the softeningpoint of an acid-modified polypropylene resin, i.e., a bonding resin,with infrared radiation and hot air, and a 20 μm thick bonding resinlayer of the acid-modified polypropylene resin and a 100 μm thickpolypropylene resin film as a heat-sealable layer were laminated to thealuminum foil by a sandwich lamination process to obtain a laminatedsheet 10. Pillow-type pouches were made from the laminated sheet 10.

A lead-insulating film 6 was made. The lead-insulating film 6 was a 100μm thick laminated film formed by laminating a 20 μm thick polypropyleneresin layer, a 60 μm thick adhesive TPX layer having a melting point of200° C., and a 20 μm thick acid-modified polypropylene resin layer of anunsaturated carboxylic acid graft polypropylene resin by a coextrusionprocess.

The lead-insulating films 6 were bonded temporarily to the upper and thelower surface of a 100 μm thick, 10 mm wide lead 4 of aluminum, the leadwas inserted in the pouch, and the pouch was heat-sealed underheat-sealing conditions including a heating temperature of 190° C., apressure of 2.0 MPa and a heating time of 3.0 s to obtain a test samplein Example 2.

Example 3 (Embossed Package)

Both the surfaces of a 40 μm thick aluminum foil were processed by thechemical conversion treatment. A 25 μm thick oriented nylon film waslaminated to one of the surfaces of the aluminum foil by a drylamination process. Then, a primary laminated sheet was formed bylaminating a 30 μm thick linear low-density polyethylene resin filmhaving a density of 0.921 to the other chemically converted surface ofthe aluminum foil by using a 20 μm thick acid-modified polyethyleneresin film as a bonding layer by a sandwich lamination process. Theprimary laminated sheet was heated at a temperature not lower than thesoftening point of the acid-modified polyethylene resin with hot air toobtain a secondary laminated sheet. Embossed case bodies were formed byembossing the secondary laminated sheet, and covers were formed bycutting the secondary laminated sheet.

A lead-insulating film 6 was made. The lead-insulating film 6 was a 40μm thick laminated film formed by laminating a 10 μm thick linearlow-density polyethylene resin film, a 20 μm thick adhesive TPX film,and a 10 μm thick acid-modified polyethylene resin film (unsaturatedcarboxylic acid graft polyethylene resin film) by a coextrusion process.

The lead-insulating films were welded to the upper and the lower surfaceof a 200 μm thick, 10 mm wide lead of aluminum such that the unsaturatedcarboxylic acid graft polyethylene resin films face the lead, the leadwas inserted in the embossed package, and the embossed package washeat-sealed under heat-sealing conditions including a heatingtemperature of 190° C., a pressure of 1.0 MPa and a heating time of 5.0s to obtain a test sample in Example 3.

Example 4 (Embossed Package)

Both the surfaces of a 40 m thick aluminum foil were processed by thechemical conversion treatment. A 25 μm thick oriented nylon film waslaminated to one of the surfaces of the aluminum foil by a drylamination process. Then, a primary laminated sheet was formed bylaminating a 30 μm thick propylene resin film having a density of 0.921to the other chemically converted surface of the aluminum foil by usinga 15 μm thick acid-modified polypropylene resin film as a bonding layerby a sandwich lamination process. The primary laminated sheet was heatedat a temperature not lower than the softening point of the acid-modifiedpolyethylene resin with hot air to obtain a secondary laminated sheet.Embossed case bodies were formed by embossing the secondary laminatedsheet, and covers were formed by cutting the secondary laminated sheet.

A lead-insulating film was made. The lead-insulating film was a 100 μmthick laminated film formed by laminating a 20 μm thick polypropyleneresin film, a 60 μm thick TPX film, and a 20 μm thick unsaturatedcarboxylic acid graft polypropylene resin film by a coextrusion process.

The lead-insulating films were welded to the upper and the lower surfaceof a 100 μm thick, 6.0 mm wide lead of aluminum such that theunsaturated carboxylic acid graft polypropylene resin films face thelead, the lead was inserted in the embossed package, and the embossedpackage was heat-sealed under heat-sealing conditions including aheating temperature of 190° C., a pressure of 2.0 MPa and a heating timeof 10 s to obtain a test sample in Example 4.

Example 5 (Embossed Package)

Both the surfaces of a 40 μm thick aluminum foil were processed by thechemical conversion treatment. A 25 μm thick oriented nylon film waslaminated to one of the surfaces of the aluminum foil by a drylamination process. Then, a 30 μm thick linear low-density polyethyleneresin film having a density of 0.921 was laminated to the otherchemically converted surface of the aluminum foil by a dry laminationprocess to obtain a laminated sheet. Embossed case bodies were formed byembossing the laminated sheet, and covers were formed by cutting thelaminated sheet.

A lead-insulating film was made. The lead-insulating film was a 50 μmthick laminated film formed by laminating a 10 μm thick medium-densitypolyethylene resin film, a 30 μm thick adhesive TPX film, and a 10 μmthick ethylene-methacrylic acid copolymer film by a coextrusion process.

The lead-insulating films were welded to the upper and the lower surfaceof a 100 μm thick, 4 mm wide lead of aluminum such that theethylene-methacrylic acid copolymer films face the lead, the lead wasinserted in the embossed package, and the embossed package washeat-sealed under heat-sealing conditions including a heatingtemperature of 190° C., a pressure of 1.0 MPa and a heating time of 5.0s to obtain a test sample in Example 5.

Comparative Example 1 (Pouch)

Both the surfaces of a 20 μm thick aluminum foil were processed by achemical conversion treatment. A 12 μm thick oriented polyester film waslaminated to one of the surfaces of the aluminum foil by a drylamination process. The other chemically converted surface of thealuminum foil was heated at a temperature not lower than the softeningpoint of an acid-modified polyethylene resin, i.e., a bonding resin,with infrared radiation and hot air, and a 20 μm thick acid-modifiedpolyethylene resin film and a 30 μm thick linear low-densitypolyethylene resin film as a heat-sealable layer were laminated to thealuminum foil by a sandwich lamination process to obtain a laminatedsheet. Pillow-type pouches were made from the laminated sheet.

A 50 μm thick acid-modified polyethylene resin film (unsaturatedcarboxylic acid graft polyethylene resin film) was used as alead-insulating film.

The lead-insulating films were bonded temporarily to the upper and thelower surface of a 100 μm thick, 4 mm wide lead of aluminum, the leadwas inserted in the pouch, and the pouch was heat-sealed underheat-sealing conditions including a heating temperature of 190° C., apressure of 1.0 MPa and a heating time of 2.5 s to obtain a test samplein Comparative example 1.

Comparative Example 2 (Pouch)

Both the surfaces of a 20 μm thick aluminum foil were processed by achemical conversion treatment. A 12 μm thick oriented polyester film waslaminated to one of the surfaces of the aluminum foil by a drylamination process. The other chemically converted surface of thealuminum foil was heated at a temperature not lower than the softeningpoint of an acid-modified polypropylene resin, i.e., a bonding resin,with infrared radiation and hot air, and 20 μm thick acid-modifiedpolypropylene resin film (unsaturated carboxylic acid graftpolypropylene resin film) as a bonding resin layer and a 100 μm thickpolypropylene resin film as a heat-sealable layer were laminated to thealuminum foil by a sandwich lamination process to obtain a laminatedsheet. Pillow-type pouches were made from the laminated sheet.

A 200 μm thick polypropylene-base acid-modified polypropylene resin film(unsaturated carboxylic acid graft polypropylene resin film) was used asa lead-insulating film.

The lead-insulating films were bonded temporarily to the upper and thelower surface of a 100 μm thick, 4 mm wide lead of aluminum, the leadwas inserted in the pouch, and the pouch was heat-sealed underheat-sealing conditions including a heating temperature of 190° C., apressure of 2.0 MPa and a heating time of 3.0 s to obtain a test samplein Comparative example 2.

Comparative Example 3 (Embossed Package)

Both the surfaces of a 40 μm thick aluminum foil were processed by achemical conversion treatment. A 25 μm thick oriented nylon film waslaminated to one of the surfaces of the aluminum foil by a drylamination process. A 20 μm thick acid-modified polyethylene resin filmas a bonding resin layer, and a 30 μm thick linear low-densitypolyethylene resin film having a density of 0.921 were laminated to theother chemically converted surface of the aluminum foil by a sandwichlamination process to obtain a primary laminated sheet. The primarylaminated sheet was heated at a temperature not lower than the softeningpoint of the acid-modified polyethylene resin. Embossed case bodies wereformed by embossing the primary laminated sheet, and covers were formedby cutting the primary laminated sheet.

A lead-insulating film was made. The lead-insulating film was a 25 μmthick laminated film formed by laminating a 15 μm thick low-densitypolyethylene resin film a 5 μm thick adhesive TPX film and a 15 μm thickacid-modified polyethylene resin film (unsaturated carboxylic acid graftpolyethylene film) by a coextrusion process.

The lead-insulating films were bonded temporarily to the upper and thelower surface of a 200 μm thick, 4 mm wide lead of aluminum, the leadwas inserted in the embossed package, and the embossed package washeat-sealed under heat-sealing conditions including a heatingtemperature of 190° C., a pressure of 1.0 MPa and a heating time of 5 sto obtain a test sample in Comparative example 3.

Comparative Example 4 (Embossed Package)

Both the surfaces of a 40 μm thick aluminum foil were processed by achemical conversion treatment. A 25 μm thick oriented nylon film waslaminated to one of the surfaces of the aluminum foil by a drylamination process. A 20 μm thick acid-modified polypropylene resin filmas a bonding resin layer, and a 30 μm thick propylene resin film havinga density of 0.921 were laminated to the other chemically convertedsurface of the aluminum foil by a sandwich lamination process to obtaina primary laminated sheet. The primary laminated sheet was heated at atemperature not lower than the softening point of the acid-modifiedpolyethylene resin. Embossed case bodies were formed by embossing theprimary laminated sheet thus heated, and covers were formed by cuttingthe primary laminated sheet thus heated.

A 100 μm thick acid-modified polypropylene resin film (unsaturatedcarboxylic acid graft polypropylene resin film) was used as alead-insulating film.

The lead-insulating films were bonded temporarily to the upper and thelower surface of a 100 μm thick, 4 mm wide lead of aluminum, the leadwas inserted in the embossed package, and the embossed package washeat-sealed under heat-sealing conditions including a heatingtemperature of 190° C., a pressure of 0.2 MPa and a heating time of 10 sto obtain a test sample in Comparative example 4.

Method of Evaluation

(1) Contact Between Lead and Barrier Layer

A part of the lead in a heat-sealed part of the package was cut, and aphotograph of a section of the lead was observed to examine thecondition of the lead relative to the package. A circuit analyzer wasused to confirm the condition of the lead relative to the barrier layerof the package when it is difficult to determine visually whether or notthe lead was in contact with the barrier layer of the package. It wasdecided that the lead is barely apart from the barrier layer when anyfilm was not found between the lead and the barrier layer of the packagein the photograph. Test samples which were determined throughexamination using the circuit analyzer that their leads were in contactwith the barrier layers were examined.

(2) Leakage

Sample heat-sealed packages were examined for the leakage of anelectrolyte 1M LiPF₆ contained in the packages through gaps around thelead after keeping the packages in an environment of 80° C. for 24 h.The electrolyte was a 1:1:1 mixture of ethylene carbonate, diethylcarbonate and dimethyl carbonate. Three grams of the electrolyte wascontained in each sample package.

Results

Contact between the lead and the barrier layer and the leakage of theelectrolyte were not found at all in the test samples in Examples 1 to5.

The leads of eighty test samples among the one hundred test samples inComparative example 1 were virtually in contact with the barrier layers,and those of sixty test samples were actually in contact with thebarrier layers. Leakage was not found in all the test samples inComparative example 1.

The leads of fifty test samples among the one hundred test samples inComparative example 2 were virtually in contact with the barrier layers,and those of forty test samples were actually in contact with thebarrier layers. Leakage was not found in all the test samples inComparative example 2.

The leads of eighty test samples among the one hundred test samples inComparative example 3 were actually in contact with the barrier layers.Leakage was not found in all the test samples in Comparative example 3.

The leads of sixty test samples among the one hundred test samples inComparative example 4 were virtually in contact with the barrier layers,and those of forty test samples were actually in contact with thebarrier layers. Leakage was not found in all the test samples inComparative example 4.

Both the test samples in Examples and those in Comparative examples weresatisfactory in other test items other than undesirable contact betweenthe lead and the barrier layer.

According to the present invention, a battery module is put in apackage, a peripheral part of the package is heat-sealed to seal thebattery module in the package. A lead-insulating film is interposedbetween the leads of the battery module and the package. Thelead-insulating film is a film formed by coextrusion and consisting of apolyolefin resin layer, an adhesive polymethyl pentene resin layer andan acid-modified polyolefin resin layer. The barrier layer of thepackage does not come into contact with the leads when the package issealed, and contents of the package do not leak.

The chemical conversion treatment of both the surfaces of the barrierlayer of aluminum of the package prevents the delamination of the baselayer and the barrier layer of aluminum when the laminated sheet issubjected to embossing and when the package is heat-sealed. Thecorrosion of the surfaces of the barrier layer of aluminum by hydrogenfluoride produced by the interaction of the electrolyte of the lithiumbattery and moisture can be prevented. The delamination of the barrierlayer of aluminum and the layer on the inner side of the barrier layercan be prevented.

What is claimed is:
 1. A battery, comprising: a battery module; abattery package for holding the battery module; and leads extending fromthe battery module and projecting outwardly from the battery package;wherein: the battery package is formed from a laminated sheet; aperipheral part of the battery package is heat-sealed; lead-insulatingfilms are interposed between the peripheral part of the package and theleads; each of the lead-insulating films comprises a heat-resistant basefilm, a first resin layer formed on a first surface of theheat-resistant base film through a first anchor coating, a second resinlayer formed on a second surface of the heat-resistant base filmopposite from the first surface through a second anchor coating, each ofthe first and second resin layers being formed on the heat-resistantbase film by an extrusion lamination process; and the heat-resistantbase film is formed of a polyethylene naphthalate resin.
 2. The batteryaccording to claim 1, wherein: the first resin layer is provided on alaminated sheet-side of the heat-resistant base film and the secondresin layer is provided on a lead-side of the heat-resistant base film;and the first resin layer is formed of a polyolefin resin and the secondresin layer is formed of an acid-modified polyolefin resin.
 3. Thebattery according to claim 1, wherein: the leads have an elongatedplate-shape or a bar-shape; and the leads are formed of a metal.
 4. Thebattery according to claim 1, wherein: the laminated sheet comprises abase layer, an aluminum layer and a heat-sealable layer; and theheat-sealable layer is formed of a polyolefin resin.
 5. Alead-insulating film for bonding a lead to a battery package, the leadextending from a battery module and projecting through and outwardlyfrom a heat-sealed peripheral part of the battery package, the batterypackage being formed from a laminated sheet, the lead-insulating filmcomprising: a heat-resistant base film; a first resin layer formed on afirst surface of the heat-resistant base film through a first anchorcoating; and a second resin layer formed on a second surface of theheat-resistant base film opposite from the first surface through asecond anchor coating; wherein: each of the first and second resinlayers is formed on the heat-resistant base film by an extrusionlamination process; and the heat-resistant base film is formed of apolyethylene naphthalate resin.
 6. The lead-insulating film according toclaim 5, wherein: the first resin layer is provided on a laminatedsheet-side of the heat-resistant base film and the second resin layer isprovided on a lead-side of the heat-resistant base film; and the firstresin layer is formed of a polyolefin resin and the second resin layeris formed of an acid-modified polyolefin resin.
 7. The lead-insulatingfilm according to claim 5, wherein: the leads have an elongatedplate-shape or a bar-shape; and the leads are formed of a metal.
 8. Thebattery according to claim 1, wherein the first anchor coating and thesecond anchor coating are formed by primer coating the respectivesurfaces of the heat-resistant base film using an imine compound, apolyethylene imine compound, an organic titanium compound, an isocyanatecompound or a silane compound.
 9. The lead-insulating film according toclaim 5, wherein the first anchor coating and the second anchor coatingare formed by primer coating the respective surfaces of theheat-resistant base film using an imine compound, a polyethylene iminecompound, an organic titanium compound, an isocyanate compound or asilane compound.
 10. The battery according to claim 8, wherein the firstanchor coating and the second anchor coating are formed by primercoating the respective surfaces of the heat-resistant base film using animine compound, a polyethylene imine compound, or an isocyanatecompound.
 11. The lead-insulating film according to claim 9, wherein thefirst anchor coating and the second anchor coating are formed by primercoating the respective surfaces of the heat-resistant base film using animine compound, a polyethylene imine compound, or an isocyanatecompound.
 12. The battery according to claim 2, wherein theacid-modified polyolefin resin is selected from the group consisting ofunsaturated carboxylic acid graft polyolefin resins, metal-crosslinkedpolyethylene resins, acid-modified polyethylene resins, andacid-modified polypropylene resins.
 13. The lead-insulating filmaccording to claim 6, wherein the acid-modified polyolefin resin isselected from the group consisting of unsaturated carboxylic acid graftpolyolefin resins, metal-crosslinked polyethylene resins, acid-modifiedpolyethylene resins, and acid-modified polypropylene resins.
 14. Thebattery according to claim 1, wherein the first resin layer has athickness of 5 μm or above, the heat-resistant base film has a thicknessof 3 μm or above, and the second resin layer has a thickness of 10 μm orabove.
 15. The lead-insulating film according to claim 5, wherein thefirst resin layer has a thickness of 5 μm or above, the heat-resistantbase film has a thickness of 3 μm or above, and the second resin layerhas a thickness of 10 μm or above.